New Projects

The following are active projects within the VITA Standards Organization (VSO). Working groups are revising or creating these standards. This high-level update is based on the results of the most recent VSO meeting and is intended for the general non-member public. VITA Members can obtain members-only detailed status on each working group after logging into their account.

Contact VITA if you are interested in joining VITA and participating in any of these working groups. Visit Events for details on upcoming VITA meetings. If your company is not attending, you are missing an excellent opportunity to network, contribute and influence the future of VITA standards.

VITA 48.9

VPX AFT Cooling - Retractable Seals

Abstract: This standard defines an airflow through module format, 3U and 6U, that uses retractable module rack seals to improve module – chassis seal durability, simplifies the design by eliminating tapered module and chassis features, and allow easy migration of existing CCA designs to an air cooled module format.
Status: Working group is developing a draft document.

VITA 57.1

FPGA Mezzanine Card (FMC) Standard

Abstract: This standard describes the compliance requirements for an FPGA Mezzanine Card (FMC) IO module which utilizes a mezzanine module to provide for a low overhead protocol bridge between a carrier card 's front panel IO and an FPGA processing device on the carrier card. This revision provides for larger EEPROMs, relaxes ground requirements, and allows for higher current on 3P3V AUX.
Status: This standard is under consideration for revision pending editing resource availability.

VITA 57.4

FPGA Mezzanine Card Plus (FMC+) Standard

Abstract: This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mechanical standard. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Additional signals to support backplane reference clock and synchronization have been added. The VITA 57.4 specification is backwards compatible in that a VITA 57.4 carrier card can still support a VITA 57.1 FMC.
Status: This standard is under consideration for revision pending editing resource availability.

VITA 89

MT Circular Connectors - Type 2

Abstract: Defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for up to 48 fibers per MT and for physical contact or lensed MT.
Status: VITA working group to develop a new standard for circular connectors with optical MT. Working group is developing draft document.

VITA 90.5

Space VNX+

Abstract: This standard defines a scalable, portable, resilient, and modular VNX+ Architecture used in small spacecraft.
Status: Working group formed to make revisions to VNX under VNX+ for development of a potential standard for space platforms.

VITA 91.1

System Standard for Higher Density VITA 46 Applications

Abstract: This standard defines a system definition that provides higher pin density to the backplane for VPX applications.
Status: VITA working group to develop a new standard for higher pin density for VPX. Project currently on hold.

VITA 94.0

Power Distribution Plug-In Module

Abstract: This standard provides requirements for building a power distribution Plug-In Module with digital controls that can be used in a VPX chassis. The Plug-In Module will fit within the standards envelope defined for VPX modules in the VITA 48.x standards.
Status: Working group is developing draft document.

VITA 95.0

Circular 38999 Connector with EBO Fiber Technology

Abstract: This document defines a standard for circular connectors with Expanded Beam Optical (EBO) ferrules. Circular connector shells are compliant to MIL-STD-38999 Series III. EBO ferrules are available in multimode or single mode.
Status: Working group is developing draft document.

VITA 96.0

Backplane Connectors with EBO Fiber Technology

Abstract: This document defines a standard for Backplane Connectors with Expanded Beam Optical (EBO) ferrules. EBO ferrules are available in multimode and singlemode.
Status: Working group is developing draft document.

VITA 100.10

VITA 100 Mechanical Common Base Standard

Abstract: The V100.10 standard defines common mechanical requirements for Plug-In Modules (PIM). Two types of Plug-In Modules are defined: Type 1 and Type 2. These types help PIM vendors to define rugged implementation, two-level maintenance, common components and other specifics that are applicable to all the V100.1X standards. There is also a suggestion for PIM vendors to design using a common Printed Wiring Board (PWB) size. This will allow for simple cooling method changes, using the same PWB, by changing the heat frame and cover designs.
Status: Working group is developing draft document.

VITA 100.11

VITA 100 Conduction Cooling ICD Standard

Abstract: This standard defines the mechanical requirements for conduction cooled (CC) Plug-In Modules (PIMs), Chassis ', and Backplanes in the V100 ecosystem.
Status: Working group is developing draft document.

VITA 100.20

System Management for VITA 100

Abstract: This document defines an architecture and implementation requirements for system management in VITA 100-based systems. It addresses both out-of-band and in-band system management across all operating states and enables system management interoperability within the VITA 100 ecosystem at the Field Replaceable Unit (FRU), chassis, and system levels.
Status: Working group is developing draft document.

VITA 100.30

Connectors for VITA 100 Applications

Abstract: This standard defines the connectors used in all the VITA 100 Standards. The VITA 100.30 connectors support higher pin density, speed and power for electrical contacts compared to the VITA 46 connectors. VITA 100 connectors are not intermateable to VITA 46 connectors.
Status: Working group is developing draft document.

VITA 100.31

VITA 100 Optical and Coaxial Connector Modules

Abstract: This standard defines the optical and coaxial interconnect for use in VITA 100 applications. The standard includes both the optical and coaxial contact interfaces and performance requirements, as well as connector module outline dimensions and backplane aperture sizes. The contact arrangements for a specific connector module are defined in VITA 100.1, along with the slot profiles that utilize them.
Status: Working group is developing draft document.

VITA 100.40

Advanced VPX Modular Power Supply Standard

Abstract: This standard provides requirements to build an Advanced VPX Power Supply Module that compliments and is compatible with the VITA 100 family of standards.
Status: Working group is developing draft document.